Understanding the Multilayer PCB: A Key Component in Modern Electronics
The world of electronics has seen a significant shift with the advent of Multilayer Printed Circuit Boards (PCBs)1. These PCBs, which consist of three or more layers of copper foil insulated from each other, have become a staple in complex electronic designs.Get more news about
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Initially, electronic components were available in DIP packages only and PCB boards were large-sized, thus having more space for the PCB wirings/connections. But with the research in nanotechnology, electronics introduced SMD (Service Mount Device) components. These small-sized components aimed to reduce the overall size of electronic kits/circuits.
However, in complex designs, there’s not enough space to pass the tracing lines of connection wires. To overcome this issue, Multilayer PCBs were introduced, where connections/wirings are split across different PCB boards (called layers) and these layers are laminated to keep them insulated from each other and glued together.
A PCB is called Multilayer PCB, if it has 3 or more layers (sheets) of copper foil, insulated from each other (by lamination or coating) and joined together to form a single piece. A Multilayer PCB has an Inner Layer Core present at the center of all the layers and coated with a Copper layer from both sides, while layers of prepreg (woven glass cloth with epoxy resin) are used for insulation.
In Multilayer PCB, outer layers (top & bottom) are single-sided PCBs, while the inner layers are double-sided PCBs. In multiplayer PCBs, few layers might be assigned with fixed tasks and are termed as planes i.e. power planes, ground planes.
Multilayer PCB technology enables denser, higher performance electronic designs by utilizing stacked circuit layers interconnected through plated holes and vias. Realizing the benefits requires expertise in specialized materials, modeling tools, thermal and signal integrity techniques, reliability testing and advanced manufacturing processes.
Fabricating a multilayer PCB requires specialized sequential lamination processes to bond multiple double-sided circuit layers together into a consolidated board. The typical manufacturing steps include Inner Layer Formation, Layer Lamination, Drill Holes, Hole Plating, Outer Layer Processing, and Testing and QA.
In conclusion, Multilayer PCBs have revolutionized the electronics industry by enabling the creation of compact, high-performance devices. As technology continues to advance, the importance and utilization of Multilayer PCBs are only expected to grow.
